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TEL62 Project Update: PCB Assembly Progress and Initial Testing

An update on the TEL62 project: 2 PCBs received, 1 almost assembled, tests starting next week. Key focus areas include power, clock distribution, FPGA, and more. Stay tuned for pictures!

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TEL62 Project Update: PCB Assembly Progress and Initial Testing

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  1. TEL62 project update Elena Pedreschi INFN-Pisa

  2. TEL62 • Status: • 2 PCBs received 2 weeks ago • 1 is almost assembled • Should be in Pisa Friday • Initial (acceptance) tests will start next week • Power • JTAG chain • Clock distribution • FPGA functional test • CCPC boot and connection to Glue Card • DDR2 and QDRI • Complete test requires some time … TDAQ 6-4-2011

  3. Pictures • PCB Top TDAQ 6-4-2011

  4. Pictures • PCB Bottom TDAQ 6-4-2011

  5. Pictures • PCA Bottom (from assembly company) TDAQ 6-4-2011

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