ATLAS-UK Tracker Upgrade

1. ATLAS-UK Tracker Upgrade Overview R.Nickerson Programme Status I.Wilmut [hat 2] WP2 Peter Phillips WP3 Bart Hommels WP4 Tim Jones WP5 Craig Buttar [hat 3] B180 Todd Huffman Irradiation Paul Dervan

2. Purpose • International Programme • Interaction with ITK, LSWG, IWG, SWG,.. • Top Level Deliverables • Schedule Comments

3. Purpose • Central Tracker will be scrap in ~7-8 years • Physics will demand replacement • Study new physics in detail • Or extend discovery range • Or both • Detail of design possibly/probably influenced by results • Much will not be • Basic requirements unlikely to be • Proceed using sensible assumptions • No choice as time scales very long for Inner Tracker

4. Interaction with ITK Nigel Hessey Uli Parzefall Allan Clark ITK LSWG contacts Integration WG Simulation WG Module WG ‘Constant’ contact Periodic reports Pixel WG ? Themed Meetings LSWG Coordinators Requests for information Interaction withother ITK WGs Barrel stave LS Pixels LS InformationGathering IBL LS BS LS group Supermodule LS BS LS nation 2 Forward Strip Stave LS ….

5. International Efforts ‘later’ pixels Fwd strip stave Barrel strip stave IBL USA – Berkely & Brookhaven Labs + usual university groups UK KEK NIKEV Geneva Valencia DESY supermodule Specifications Materials Radiation Studies … NOT exhaustive list!

6. Top level Deliverables Reminder of the goals of the UK programme: • Practical, Inexpensive, Massless Design for Replacement Inner Tracker • Integration of UK effort into International Effort • Leading Role for UK groups (high vis). • Demonstration of UK ability to deliver substantial elements of next generation detector • Reinforcement of UK leading position with strip technology • Expand UK participation in pixel technologies and detectors

7. Top level Deliverables • To achieve these goals • Necessary work in most areas of strip tracker, but emphasis chosen to benefit from particular skill sets available. • More selective work in pixel detectors • Broken into • 3 strip Workpackages and 1 pixel workpackage • most work resides in these • Programmes – span workpackages • B180 • Irradiation • Staves & stavelets

8. The top level deliverables • These are final outputs which combine the efforts of the workpackages • Fully tested, fully populated, full-size stave using 250nm chipset • Advanced full size thermomechanical stave for the 130nm chipset • Electrical Stavelet for 130nm chipset with a 130nm module. • 4-chip pixel module using FEI-4 chipset • Mechanical prototype support for pixel modules • Report establishing these elements as appropriate in the context of an integrated design for the ID. • These deliverables include the radiation tested sensors asics & modules, power systems, DAQ, stave cores, cooling, tapes, etc.. • The component parts will be described in the WP and programme reports.

9. WP2: Deliverables and Key Notes • Key Progress • Optimisation of module glue layer • Reduced module noise • Roll-out of hybrid and module assembly to multiple institutes • Skill Transfer • UK and Overseas • Key Issues • Breakdown of FZ1 sensors • May need to be replaced • Double Trigger Noise on SP modules • Resolution may involve changes to tape design, extra decoupling and/or revised module hook-up

10. WP3: Deliverables and Key Notes Key Progress Key Issues Hardware between HSIO and EOS controller, including Versatile Link completed 1010

11. WP4: Deliverables & Key Notes UK Annual Review (WP4)

12. WP4 Deliverable Summary UK Annual Review (WP4)

13. WP4 Full Milestone List UK Annual Review (WP4)

14. WP5: Deliverables & Key Notes • Progress with all deliverables except mechanics • IBL: TB and sensor testing in progress BUT still waiting for delivery of USBPIX • Modules: • Planar quad sensor design agreed • FE-I4 wafers procured • VTT order placed for UBM and flip-chipping • Starting to discuss 3D quad module • Layout studies: • Lampshade geometry implemented • Studies using FATRAS starting • Need performance studies to determine the optimum geometry • Interconnects: • Discussion with ACREO for MCMD processing started • In discussion with RAL bump-bonding • No progress on TSVs (likely to drop) • Mechanics: • Programme undefined, disks vs lampshade issues BUT maybe look at disks anyway 1st ATLAS Upgrade OsC

15. B180 Programme Test Area for irradiated sensors, modules, staves, parts Establish presence at CERN, forge links with partners Programme defined, preparation in progress Irradiation Programme Coordinate Irradiation Campaigns Establish B’ham cyclotron as useful facility Underway

19. Schedule Comments • Not possible to accurately predict the overall build schedule requirementin the absence of completed design. However experience suggests thattime available is needed, assuming a 2020 or 2021 installation. • Surface Assembly at CERN • Surface Test • Installation • Service installation/connection • Very large job for current detector • Process will need to include removal of existing detector must be completed in faster time, • Implies Assembly and test will be more ‘complete’ • and will need extended surface time. • 2 - 3 years on the surface with all components available • 2020 – 3 = 2017, which is 6 years from now. • Comparable to the time needed for existing detector. • R and D urgent.