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Interconnect and Packaging Chapter 2: Transmission Line Parameters

Interconnect and Packaging Chapter 2: Transmission Line Parameters. Chung-Kuan Cheng UC San Diego. Outline. Causality Transmission Lines for Digital Applications Transmission Line Structures Time Domain Reflectometer LC Measurement Internal RL Analysis Proximity Effect PCB Properties

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Interconnect and Packaging Chapter 2: Transmission Line Parameters

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  1. Interconnect and PackagingChapter 2: Transmission Line Parameters Chung-Kuan Cheng UC San Diego

  2. Outline • Causality • Transmission Lines for Digital Applications • Transmission Line Structures • Time Domain Reflectometer • LC Measurement • Internal RL Analysis • Proximity Effect • PCB Properties • Slow Waves

  3. Causality

  4. Transmission Lines for Digital Systems

  5. Transmission Line Structures

  6. Time Domain Reflectometer TDR

  7. Wave Propagation

  8. Wave Propagation

  9. LC Measurement

  10. Round-Wire Internal RL

  11. Internal Impedance of Round-Wire

  12. Proximity Effect

  13. Proximity Effect via Eddy Current

  14. Properties of PCB Materials

  15. Slow Wave Mode

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