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Sputtering Deposition System

yamin avatar
yamin
13 diapositives · 750 Views · Feb 12, 2012

Project Proposal. Sputtering Deposition System. R eginald B ryant X u S un MAS 961, Spring 2004. Presentation Overview. Project Overview System Description Functionality Design Process Hello-World Demonstration. I. Project Overview. A Gas Sputter Deposition System is proposed.

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Sputtering Deposition System
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  1. Project Proposal SputteringDeposition System Reginald Bryant Xu Sun MAS 961, Spring 2004

  2. Presentation Overview • Project Overview • System Description • Functionality • Design Process • Hello-World Demonstration

  3. I. Project Overview • A Gas Sputter Deposition System is proposed. Basic function is deposition of conductive and dielectric materials (including Al, SiN…) on various substrates (including Si, SiO). • The Advantage of this system over the existing technology is:

  4. System Description • There are primarily SIX components in the system: 1. Target System ----- target material layer to be deposited on the substrate 2. Shutter & Masks ----- programmable deposition pattern 3. Plasma Sources ----- plasma hitting and kicking off target particles 4. Movement Control System ----- XYZ movement of target layer and/or shutter masks 5. Sample Holding System ----- fixed plane to hold sample at the bottom of enclosure 6. Enclosure & Pump ----- Entire system is enclosed in rare gas environment with temp, pressure control

  5. 1. Target System • Function: ----- Holding target heads • Design Parameters: ----- Quality of target layer (existing standard deposition technology) ----- Topology of heads We plan to make only two target heads for prototyping

  6. 2. Shutter and Masks • Function: ----- Deposition pattern one-use masks or programmable reusable shutter • Design Parameters: -----The complexity and resolution of the pattern

  7. 3. Plasma Source • Function: ----- Use high microwave voltage to generate Argon plasma. Electrons in plasma heat target material and kick them out. • Design Parameters: ----- Power level of plasma source, control electrical network.

  8. 4. Movement Control System • Function: ----- Control the movement of deposition-head including X-Y-Z- axis. • Design Parameters: ----- Movement precision and operation complexity ----- Good to compatible with existing prototyping machine such as Modella, laser cutter or waterjet

  9. 5. Sample Holding System • Function: ----- holding the sample substrate • Design Parameters: ----- easy to operate

  10. 6. Enclosure and Pump • Function: ----- Include all the parts of system in a vacuum enclosure to ensure a clean environment. Temperature control. • Design Parameter: ----- Reasonable vacuum, temperature

  11. Functionality • Deposition Scaling from 10 microns to 10 nanometers. • Monolithic Passive components • Monolithic Active components • Multilayer chip

  12. Design Process • Physical Modeling • Theoretical analysis of required temperature, pressure, geometry • Computer simulations of deposition process • Design Optimization -- Different schemes, e.g. target heads movable or masks movable or both • Component fabrication -- Target heads, shutter/masks, enclosure, electronic parts • Component Test -- • System Assembly

  13. Hello-world demonstration • Multilayer conductive wires sandwiched between insulators. • Test the electrical quality, i.e. continuity of the wires and isolation of different layers