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This presentation provides the status update of the coil and the ongoing investigation into the bumps and ridges observed on the coil's outer surface. It includes CMM measurements, comparison with impregnation fillers, and next steps.
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QXFA115-QXFA118 Coil Status Fred Nobrega Coil Working Group Meeting — 29 Aug 2019
Coil Status at Fermilab • QXFA118 – Cable rope during winding L2, 15th turn, 2 turns past the wedge. Investigation in progress. • QXFA117 – Outer layer prep for impregnation complete sans quench heater trace. Trace expected in ~3 weeks. • QXFA116 – Impregnation complete. Removal of epoxy flash and cleaning of holes in progress. • Fuji film imprint of coil OD showed no indication of ridges like coil QXFA115. (see backup slides for more info) • CMM inspection to confirm Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
Coil Status at Fermilab • QXFA115 – Coil quarantined and not shipped to LBNL. • Remove ridges (bumps) to salvage coil for magnet. Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
QXFA115 Rework Plan • Using Engineer's blue and ID of tooling form block, mark high points on the coil OD. • Use scraper tool to remove the high points • Scraper removes ~.1-.3 mils (3-9 microns) at a time • Repeat until Engineer's blue is uniformly distributed on coil OD. • Remove Engineer's blue with alcohol. • CMM coil inspection. Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
Coil Status at Fermilab • QXFS10 – Coil impregnation complete. Epoxy flash cleanup in progress. • Coil OD: One layer Hexcel 4522, trace, one layer Hexcel 4522, was trace then 2 layers Hexcel 4522 • Coil ID: 2 layers Hexcel 4522, was one layer BGF6781 Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
OTHER SLIDES Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
IntroductionCMM Comparison of Coil A115 and Reaction-Impregnation Filler and QXFA116 Fuji film • QXFA115 CMM measurements indicate a bump on the coil about 0.09 mm above the coil outer surface that runs longitudinally about 2 m long and is about 5 turns wide on the transition side of the coil. • A similar but smaller bump is on the coil about 0.05 mm above the coil outer surface that runs longitudinally about 3 m long and is about 5 turns wide on the non-transition side of the coil. • It is difficult to see or feel by touch the bump on the coil that is evident on the CMM plots. • The FNAL CMM plots are 2D cross sections looking from the return end of the coil to the lead end and are a best fit to the OD and midplane. The coil transition (T) side (layer jump) is on the right side of the plot and the non transition (NT) side is on the left side of the plots. • The OD tolerance is ± 0.127 mm. Red arrows on the FNAL CMM plots are used when the measurement is greater than 0.127 mm on the CMM plot • The CMM plots have additional information in a box with a leader line pointing to the surface the information pertains to. . Legend MS – Profile variation MX – Max value MI – Min value MN – Mean SD – Standard Deviation NP – # of data points Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
Location of CMM Measurements From LEbump size and longitudinal location Measured from Lead End: T, mm NT, mm Station 1 – 70 0 0 Station 2 – 270 0.062 0 Station 3 – 327 0.048 0.051 Station 4 – 740 0.091 0.068 Station 5 – 1140 0.013 0.119 Station 6 – 1540 0.069 0.093 Station 7 – 1940 0.033 0.096 Station 8 – 2340 0.053 0.075 Station 9 – 2740 0.042 0.109 Station 10 – 3140 0.051 0 Station 11 – 3540 0 0 Station 12 – 3940 0.074 0 Station 13 – 4316 0 0.078 Station 14 – 4426 0 0 Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
QXFA115 Longitudinal Bump Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
CMM of 2D Cross section Fit to OD & Sides • Stations 1 & 14 omitted (no coil straight section) Station 6 Station 2 Station 10 Station 11 Station 7 Station 3 Station 12 Station 8 Station 4 Station 13 Station 9 Station 5 Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
SS Filler & Liner Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
CMM ComparisonQXFA115 and Reaction Filler NT T NT T NT T NT T Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
CMM ComparisonQXFA115 and Reaction Filler NT T NT T NT T NT T Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
CMM ComparisonQXFA115 and Impregnation Filler X-sec #4 X-sec #4 NT T Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
CMM ComparisonQXFA115 and Impregnation Filler X-sec #5 NT T NT T X-sec #6 Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
CMM ComparisonQXFA115 and Impregnation Filler X-sec #7 NT T NT T X-sec #9 Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
QXFA115 CMM and QXFA116 Fuji Film Before Impregnation Using Same Tooling X-sec #5 NT T X-sec #6 NT T NT T NT T Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
QXFA115 CMM and QXFA116 Fuji Film Before Impregnation Using Same Tooling NT T NT T NT T NT T Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
QXFA115 CMM and QXFA116 Fuji Film Sections used for FEA X-sec #5 X-sec #4 NT T NT T Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
Next Steps • Epoxy Impregnate coil QXFA116 • Use Fuji film on coil QXFA116 before removal from impregnation tooling. • Use Fuji film on coil QXFA115 with impregnation tooling and compare results with QXFA116. • Continue to investigate cause of bumps/ridges along coil O.D. Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
BACKUP Heng’s initial analysis of coil bumps. Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
Coil 115 bumps on the OD measurements Nominal Section 4 Section 5 +120 μm +91 μm Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
Radial Displacements with the Bumps Section 5 Section 4 Radial displacement (scale x100) Radial displacement (scale x100) The bumps of 90~120 μm will impact the coil local stresses and the pole stresses Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
TF plots due to the bumps Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019
Coil Peak Stresses (Von Mises Stress, Pa) R.T. preload : Nominal Section 4 Section 5 1.9 K : Nominal Section 4 Section 5 Coil WG Mtg – QXFA115-QXFA118 Status – 29 Aug 2019