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Wire bonding and recently examined Actel FPGA devices

Dr Henning Leidecker Code 562 NASA/GSFC 16 Feb 2005. Wire bonding and recently examined Actel FPGA devices. Making a gold ball bond. Gold-Aluminum Phase Diagram. Some properties of Au x Al y. Growth of intermetallic compounds after isothermal annealing at 175 ° C in air.

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Wire bonding and recently examined Actel FPGA devices

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  1. Dr Henning Leidecker Code 562 NASA/GSFC 16 Feb 2005 Wire bonding and recently examined Actel FPGA devices

  2. Making a gold ball bond

  3. Gold-Aluminum Phase Diagram

  4. Some properties of AuxAly

  5. Growth of intermetallic compounds after isothermal annealing at 175°C in air

  6. Growth at 175°C in air --- 2 hr (top) and 200 hr (bottom)

  7. Again --- growth at 175°C in air --- 2 hr (top) and 200 hr (bottom) Again --- growth at 175°C in air --- 2 hr (top) and 200 hr (bottom)

  8. Again --- growth at 175°C in air --- 2 hr (left) and 10 hr (right)

  9. Edge growth of intermetallics ---200 hr (top) and 1000 hr (bottom), for 175°C in air

  10. We need equilibrium data and we also need kinetic (diffusion) data

  11. Effects of 'patchy' contact after 500 hr at 175°C in air

  12. Actel ball lift at 0.6 g, 72SU device Fluorine map Gold map

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