EFW DFB Systems Assurance

1. EFW DFB Systems Assurance Trent Taylor LASP

2. DFB LASP QA Organization LASP Engineering Director Configuration Management LASP Flight Assurance Manager Quality Assurance Engineer Quality Assurance Safety Build Configuration Verification Inspections Personnel Safety PMPCB, FRB, MRB Flight Hardware Safety Documentation and Records ESD Control Training and Certification Contamination Control Support Flight H/W & S/W Testing Lab Inspections 101

3. DFB PA Requirements and Safety Performance Assurance Matrix Status A few FPGA requirements still open. Closure is scheduled for 9/17/09 with APL’s acceptance of LASP’s FPGA Development Guide. Materials & Processes requirement #122 still open (see below) No waiver/deviation requests to date Materials and Processes requirement #122 of the PA Compliance Matrix may require a deviation request for LASP to use RGA instead of QCM. System Safety LASP provided initial safety input with CDRL MA-006 for PDR. There are no safety compliance issues with the EFW DFBs. LASP will provide any further safety input upon request . 102

4. DFB Suppliers and GIDEP Suppliers LASP procures all flight parts and materials through vendors on LASP’s approved vendor list. LASP procures EEE parts directly from the manufacturer or through authorized distributors. LASP requires full traceability on all flight procurements. Program requirements are flowed through procurement documentation. Where necessary, procurement documentation may include source control documents (SCDs) and engineering documentation. LASP’s DFB contains no custom or non-standard EEE parts. LASP’s DFB procurements required no additions to the LASP approved vendor list. GIDEP Status LASP has responded to APL GIDEP evaluation requests meeting all delivery dates. There are no current GIDEP “hits” – no parts on the DFB are impacted by any Alert or Advisory. 103

5. DFB EEE Parts Parts All EEE parts are procured to program requirements with no additional screening required with the exception of the following: JANTXV cavity devices (3 part types): GSFC will PIND test these parts. AD648/883B (OpAmp): GSFC will screen and qualify to EEE-INST-002 Level 2. No additional radiation testing is required. OP262GS (dual Op Amp - Plastic COTS). Parts were radiation tested by APL. GSFC will screen and qualify to EEE-INST-001 requirements. VTF100-267TBX (Resistor Network – COTS): GSFC will screen and qualify to EEE-INST-002 Level 2. 104

6. DFBMaterials & Processes Materials and Processes MIL is up-to-date Regular meetings with PMPCB Will add PWB data when ordered (will be per required IPC specs) Fasteners need to be approved Limited Life Items DFB has no limited life items 105

7. DFBConfiguration Management Configuration Management LASP uses Agile software for Configuration Management Documents submitted, reviewed, and approved electronically All documents and records are searchable As-built records and as-run test procedures archived Follow LASP’s Document & Record Control Procedure Assembly Travelers (ATs) generated and archived in the system Flight Drawing/Document Status 106

8. DFBContamination & ESD Control Contamination Control All assembly performed at laminar flow-benches Class 10,000 cleanrooms available PWAs baked out with RGA Packaging and shipping provisions to maintain low contamination exposure during transport ESD Control QA owns and implements the ESD control program LASP’s ESD Control Procedure meets ANSI/ESD S20.20 requirements All applicable personnel trained and certified by LASP’s NASA-trained Level B instructor Training certifications required for lab entry 107

9. DFBInspections • Mandatory Inspection Points and photo documentation specified • in Fabrication & Assembly Instructions (FAIs) within ATs • Audit Assembly Traveler data package at each inspection point • Check sign-offs, traceability, document revisions, etc. • Verify acceptable lab temperature and humidity • PWAs • Inspect solder workmanship to NASA-STD-8739.2 and .3 • Parts placement and orientation – per engineering drawings and FAIs • Polymerics • Inspect per NASA-STD-8739.1, FAIs, drawings, and in-house standards • Check mix records, durometer hardness of cure samples • Cables, Harnesses, Wiring • Inspect crimps, solder and other workmanship to NASA standards • Dimensions, shield terminations, shrink sleeve, etc. to FAIs, drawings, etc. • Other Inspections • Incoming/Receiving; Kitting; Pre-cap; Calibration of Equipment; Acceptance • and Environmental Test Set-up; Flight Connector Safe-to-Mate 108

10. Non-Conformance Reporting • Non-conformances addressed per LASP’s Anomaly Reporting Plan • Reporting Methods • - Fabrication and Assembly Discrepancy Report (FADR) • For rework-type non-conformances identified during fabrication/assembly • - Non-Conformance Report (NCR) • Level 1 NCR- for minor discrepancies • Level 2 NCR- for test failures and other issues occurring after program Pre- • Environmental Review, or for any anomaly that the Integrated Project • Development Team (IPDT) determines to warrant Level 2. • - Dispositions include: scrap, rework, return to supplier, refer to MRB • Processing of Level 2 NCRs is consistent with standard Failure Review • Board (FRB) practices. • - Material Review Board (MRB) report • Dispositions include: scrap, rework, return to supplier, repair by standard or • non-standard procedures, use-as-is, request for waiver • Customer participation and approval required 109