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Overview of PCB Workshop Activities: Multilayer Fabrication, Flex Technology, and Production Capacity

This document outlines the manufacturing capabilities and activities of the PCB workshop led by Julien Burnens at FSU TE40. It covers aspects of multilayer fabrication, flex technology, and production planning. Key highlights include production capacity metrics, processes for double-sided and multilayer PCBs, and quality control methods following IPC standards. Additionally, it discusses collaborations, staff training, and ongoing projects, positioning the workshop at the forefront of PCB manufacturing innovation.

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Overview of PCB Workshop Activities: Multilayer Fabrication, Flex Technology, and Production Capacity

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  1. FSU TE40 Activity Julien Burnens TE-MPE-EM PCB Workshop Bruun & Sorensen

  2. Outline • FSU TE 40 • Organization • Manufacturing • Production capacity • Multilayer Fabrication • Flex Technology • Realizations • Others activities • Conclusion Julien Burnens

  3. FSU TE40 • S144 contract • 12 collaborators Cegelec – BS • Standard PCB manufacturing • Origins • Design Office • Privates Clients • RD51 • Financial Point Julien Burnens

  4. Organization • TE40 check point every month • Working charge • Daily Loadfollowing • Price tool (chouette) • Planning • Fabrication process suite • Production overview • Delays: • Quotation: 2 days • Double side: 5 days • Multilayers: 15 days • Quality: IPC rules • Overproduction rate (objective at 5%) • Rubbish rate (objective at 3%) Julien Burnens

  5. Production capacity • Resolutions: • FSU: pitch 100um (50um strip + 50um isolation) • Staff: pitch 50um • Sizes: • 4 rigid panels: 180x230mm -> 500x650mm • Equipments: 600mm width, (1200mm in 2014) • Number of layers: • Simple side -> 20 layers • Thickness: 15um -> 2cm / Copper: 5um ->200um • Plated holes: • Mechanic: up to 200um • Chemic: up to 50um Julien Burnens

  6. Multilayer Fabrication • Internals sides • Transfer (lamination, insulation, development) • Etching and stripping • Pressing • Drilling • Plating • Externals sides • Etching • Mask and silk • Electrical test • Cutting Julien Burnens

  7. FlexTechnology • Double sides flex • Copper image • Kapton etching (ethylene diamine) • Plating • … • Sequential manufacturing : • Pressing kapton /copper • Copper image • Kapton chemical etching (ethylene diamine) • Epoxide glue chemical etching (sulfuric acid) • Plating • … Julien Burnens

  8. Realizations • Highlights: • ATPF: Flex Cable • UniBe/LHEP: flex cable 2.0m • Coils: 60 layers • Heater: aluminum 1.50x0.60m • Totem: bonding windows • NA62 web: hybrid flex-rigid • Inner resistivestructure Julien Burnens

  9. Otheractivities • Gem – 2 posts • Standard 100x100mm • Big size single side Gem(1.2mx60cm) • Thick Gem • Standards detectors – 1 post • Standard Gem 100x100mm • Standard resistive Bulk 100x100mm • Flex read-out – 1 post • KLOE Read-out Julien Burnens

  10. Conclusion • Standard Manufacturing • Production control (indicators) • Process stabilization • New collaborators training • Specials realizations • Gem • Read-out and detectors • Special jobs (size, resolution, flex-rigid) • Staff support • Manufacturing steps • Technology advertise for developments • Tests and prototypes Realization • New building and machines Julien Burnens

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