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This document provides a comprehensive update on the hardware status of the GOLD project as of March 3, 2010. It details the construction progress, including an approximate floor plan highlighting key components such as Z3, L, 5* XC6VLX, and 4* XC6VHX with a total of 144 multigigabit links in Zone 2. The status of schematics, routing details, and expected lead times for critical components, including AVAGO and Xilinx devices, are outlined. Ongoing firmware development for VME bus extensions is also included to ensure smooth operation.
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Hardware status GOLD Update 03 Mar. 2010
GOLD floor plan(approximate) • Z3 • L • 5 * XC6VLX (L,M) • 4* XC6VHX (H) • 144 multigigabit links in zone 2 (equiv. 22300 bit / BC) • L • Opto • L • L • M • Z2 • H • H • 890Gb/s • total • H • H • Z1
GOLD – current status • Schematics partially done • Routing as shown: • xGb/s links hand routed • ‘Low’ speed links (1Gb/s) to be auto routed
GOLD status • Schematics and layout under way • Components ordered. Lead time: • AVAGO (2*T, 2*R) : arrived • SNAP12 : mid April • Xilinx XCVLXT: 8-10 weeks • Production of Xilinx HXT devices delayed Firmware activities: Currently working on extension of VME bus from 9U processor crates, via BLT module, optically into GOLD