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Automated HIC Assembly System Requirements and Time Estimation Analysis

This document outlines the requirements and assembly steps for the Integrated Board (IB) module assembly process, specifically focusing on achieving chip position accuracy of ~5 mm and ensuring full repeatability and reliability during assembly. It details the placement and soldering steps for chips using flex and soldering grids, with an emphasis on quality checks through automated vision systems. Cycle time estimations for normal and worst-case scenarios are provided for varying chip configurations, detailing the time needed for assembly within an 8-hour workday over the course of a year.

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Automated HIC Assembly System Requirements and Time Estimation Analysis

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  1. IB module assembly A. Di Mauro (CERN) WP6 meeting 30.01.2014

  2. Requirements • Chip position accuracy ~ 5 mm • Time ~ 2-3 h/HIC • Minimum material budget • Full repeatability/reliability • “Reworkability” (as much as possible)

  3. IB module assembly steps • Placement of chips on vacuum table and position check • Placement of flex on vacuum table and alignment • Placement of soldering grid on flex and alignment • SnAg soldering balls deposition and check • Soldering of one chip and check • Repeat steps 4 and 5 for all chips • Final check of chips position Comments related to use of artificial vision based automated system: • Steps 1-3: positioning/alignment done at the same time by a.v. • Step 4: soldering balls presence checked by a.v., possibility to intervene at level of single hole • Step 5: quality of each soldering checked by a.v. and pyrometer feedback (combination to be developed)

  4. Automated HIC assembly system from VEA Cycle time estimation • A) Worst case scenarios: • 9 chips → 9x8.1 + 8.5 + 8.5 + 9x(4x10.5) + 9x(88x10) = 8388” = ~ 2 h 20’ • 2x7 chips → 14x8.1 + 8.5 + 8.5 + 14x(4x10.5) + 14x(88x10) = 13039” = ~ 3 h 38’ • B) Normal case scenarios (soldering time/contact ~ 5 s*): • 9 chips → 9x8.1 + 8.5 + 8.5 + 9x(4x10.5) + 9x(88x5) = 4428” = ~ 1 h 14’ • 2x7 chips → 14x8.1 + 8.5 + 8.5 + 14x(4x10.5) + 14x(88x5) = 6878” = ~ 1h 55’ • * shorter time could also be possible 4

  5. Automated HIC assembly system from VEA Assuming 100 HICs for IB and 1800 HICs for OB and 8 h working day, 220 working days / year • 234 h for IB + 6540 h for OB -> 850 d -> ~ 4y • 124 h for IB + 3450 h for OB -> 450 d -> ~ 2 y

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