'Fe i4' diaporamas de présentation

Currently and Advanced Pixel designs for HEP

Currently and Advanced Pixel designs for HEP. Patrick Pangaud Centre de Physique des Particules de Marseille C.P.P.M 163 , avenue de Luminy Case 902 13288 Marseille cedex 09 France pangaud@cppm.in2p3.fr. Hybrid pixels sensor for High Energy Physics. IBM 130nm : FEI4 development

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FE-I4 Architecture & Performance

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FE-I4 pixel readout chip and IBL module

FE-I4 pixel readout chip and IBL module. Marlon Barbero Bonn University On behalf of ATLAS FE-I4 / IBL collaboration Vertex 2011 Workshop, Rust - Austria, June 1 9 th - 24 th 2011. Plan. FE-I4: A new Front-End generation for the upgraded ATLAS pixel detector. IBL module concept.

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IBL Insertable B -Layer

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Tracking detector for AFP Upgrade Project

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Recent Achievements of the ATLAS Upgrade Planar Pixel Sensors R&D Project

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ATLAS Insertable B-Layer (IBL)

ATLAS Insertable B-Layer (IBL). LHCC Upgrade Review CERN, February 16, 2009 G. Darbo - INFN / Genova LHCC Review Agenda page: http://indico.cern.ch/conferenceDisplay.py?confId=52276. From Replacement to Insertable BL. One and half year ago (29/9/2007) the B-Layer Replacement Workshop.

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FE-I4 Digital Test Bench

FE-I4 Digital Test Bench. Tomasz Hemperek. Introduction. SystemVerilog OVM Methodology Can to use rtl, syntchesis, post route/layout models. 2. FE-I4 Top View. ANALOG ARRAY (digital part). DIGITAL ARRAY. END OF COLUMN. END OF CHIP. COMMA N D DECODER. PLL. PLL. REGISTER MEMORY.

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FE-I4 and testing status

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Status productions of 3D at CNM

Status productions of 3D at CNM. G. Pellegrini D. Bassignana, JP Balbuena, E. Cabruja, C. Fleta, C.Guardiola, M. Lozano, D. Quirion, M.Ullan. Outline. Description of the technology Activity on 3D detectors: FE-I4 Atlas pixels for IBL and atlas upgrade Future improvements.

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Insertable B-Layer Status & Plans

Insertable B-Layer Status & Plans. ATLAS Inner Detector General Meeting CERN, 28 November 2008 G. Darbo - INFN / Genova Workshop page: http://indico.cern.ch/conferenceDisplay.py?confId=22937. From Replacement to Insertable BL. One ye ar ago (29/9/2007) the B-Layer Replacement Workshop

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Verification of complex mixed signal ASICs

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Development of novel n + -in-p Silicon Planar Pixel Sensors for HL-LHC

Development of novel n + -in-p Silicon Planar Pixel Sensors for HL-LHC. Y. Unno a , J. Idarraga 1 , S. Mitsui a , R. Hori a , R. Nagai g , O. Jinnouchi g , A. Lounis 1 , Y. Takahashi h , K. Hara h , S. Kamada b , K. Yamamura b , A. Ishida b , M. Ishihara b , T. Inuzuka b ,

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WP3: Post processing and 3D I nterconnection

WP3: Post processing and 3D I nterconnection. M. Barbero , L. Gonella , F. Hügging , H. Krüger and N. Wermes AIDA Kick-Off Meeting CERN, 16-02-2011 – 18-02-2011. Introduction. Post processing and 3D Interconnection many possibilities e.g. material reduction of futures trackers.

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IBL MoU

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Medipix sensors included in MP wafers

Medipix sensors included in MP wafers. Produced by Micron Semiconductor on n-in-p wafers (150 and 300 m m thick). To achieve good spatial resolution through efficient charge collection:. - HV performance (main focus in this work) - Optimal implant geometry. 2.

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IBL @ October RRB

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ATLAS FP TRACKER PLANS

ATLAS FP TRACKER PLANS. Steve Watts School of Physics and Astronomy University of Manchester. Well defined design in the FP420 Design Report Based on the FE-I3 ATLAS Pixel Readout chip. Design suitable for 220 but needs roughly double the number of

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