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Product Presentation

Product Presentation. Updated: 30 th May 2004. Outline. Product overview Fabry-Pérot (FP) laser products Distributed Feedback (DFB) laser products Future products Conclusion. Wavelengths 808 nm 920 nm 1310 nm 1490 nm 1550 nm Custom Types Fabry-Pérot (FP) DFB. Packages Bare die

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Product Presentation

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  1. Product Presentation Updated: 30th May 2004

  2. Outline • Product overview • Fabry-Pérot (FP) laser products • Distributed Feedback (DFB) laser products • Future products • Conclusion

  3. Wavelengths 808 nm 920 nm 1310 nm 1490 nm 1550 nm Custom Types Fabry-Pérot (FP) DFB Packages Bare die Chip-on-submount TO-CAN TOSA Coaxial Modulation CW / Pulsed 1.25 Gb/s 2.5 Gb/s 10 Gb/s Laser Product overview

  4. Modulight 1310 nm FP laser diode products for digital applications

  5. Modulight 1310 nm FP laser products • Laser product family for different needs and applications: • ML-C-1310-FP-10G laser chip • 10 Gb/s FP laser chip for 10G transponder and transceviver manufacturers • SONET OC-192 VSR (< 600 m) • SDH STM VSR-64.1r, STM I-64.1r (< 600 m) • OIF VSR-4, (< 600m) • 10 Gb/s over FDDI-grade MM fiber (220-300 m)

  6. Modulight 1310 nm FP laser products • ML-C-1310-FP-2G5 • Bare 2.5 Gb/s FP die for full packaging and assembly lines • SONET OC-48 SR / SDH STM I-16 • 1.25 Gb/s Gigabit Ethernet • 1.06 Gb/s / 2.125 Gb/s Fibre Channel • ML-T-1310-FP-2G5-F/B-X • ML-C-1310-FP-2G5 laser chip in a TO-56 can for 2.5 Gb/s and 1.25 Gb/s TOSA and transceiver manufacturers • Available with flat window and ball lens caps • Please inquire custom caps

  7. Modulight 1310 nm FP laser products • ML-COAX-1310-FP-2G5-2 • Reliable coaxial fiber pigtail module with ML-C-1310-FP-2G5 chip • 2 mW output power • Selectable connector • ML-W-1310-FP-2G5 1310 nm FP epiwafers • 1310 nm FP epiwafers with Modulight’s high-performance design or with customer’s own design

  8. Competitive advantages • Narrow spectral linewidth enables longer transmission distances with high-speed operation • Strong core material design with superior temperature behavior for uncooled applications • Controlled beam characteristics for optimal coupling efficiency • Controlled design and manufacturing process from epiwafer to TO-can level • Reliable long-term chip supply • Custom features available with short lead time to production

  9. ML-C-1310-FP-10G –10 Gb/s FP • Proven robust manufacturing process inherited from 2.5G product • 10 mW kink-free output power up to 85°C • Narrow linewidth (typ. RMS 1 nm, -20 dB noise floor) reduces chromatic dispersion • High-speed operation also at elevated temperatures • Alignment features for automated pattern recognition • Superior characteristic temperature of >91K 25-85°C, >88K 15-95°C (cw)

  10. ML-C-1310-FP-10G – high-temperature operation 10 mW kink-free single transverse mode cw power 5 W serial resistance Stable slope efficiency Example data: 10 devices from different laser bars

  11. ML-C-1310-FP-10G – good fiber coupling • Good beam shape for optimal coupling efficiency • Typical beam ellipticity ~1.4 Horizontal FWHM 24.33° Vertical FWHM 34.42°

  12. ML-C-1310-FP-10G – reliability

  13. ML-C-1310-FP-10G – S21

  14. ML-C-1310-FP-10G –narrow spectrum Excellent linewidth in broad temperature range

  15. ML-C-1310-FP-10G – eye pattern Rise time 39.6 ps (20-80) Fall time 46.7 ps (80-20) Jitter pk-pk 19.11 ps Jitter rms 3.31 ps S/N 10.21 ER > 5 dB (Modulight 10Gb/s die in customer 10 Gb/s TO-can, Ib = 40 mA, room temperature, filtered)

  16. ML-C-1310-FP-10G – eye pattern 10.312 Gb/s Eye-Pattern [N=231-1], 10GBASE-R mask, 20% margin (example data from customer sub-assembly, Iljin Corp.)

  17. ML-C-1310-FP-2G5 • 1310 nm bare FP laser die for up to 2.5 Gb/s digital applications • For customers with own packaging and assembly lines • Reliable AlGaInAs/InP epi structure with Modulight’s high-performance design • 7 mW rated output power (to be upgraded) • >2.5 Gb/s operation -40-85°C • Low <5 W serial resistance • Automated testing in Modulight’s verification process at 25°C and 85°C • I-L curve (Ith, Iop, slope, kink power) • I-V curve (Vop, Rs) • Spectral measurement (Central wavelength, RMS spectral width) • Beam shape (ThetaV, ThetaH)

  18. ML-C-1310-FP-2G5 • Narrower (<1 nm) spectral width than for competing 1310 nm FP laser products • Reduced chromatic dispersion • Longer transmission distances than with conventional MLM lasers

  19. Developed for mass production • Modulight’s chip products developed to match customers’ automated process lines • Die-shear force typ. 390 g • Ball shear force typ. 48 g • Wire pull strength >6 g • Metal reflection and dicing quality suitable for pattern recognition methods • Good beam shape for optimal coupling efficiency • Typical beam ellipticity ~1.4 (32:23)

  20. Unbeaten temperature performance • Best 2.5 Gb/s 1310 nm high-temperature FP laser chip in the market • Suitable for uncooled transmitters, transceivers and transponders • Best high-temperature performance • Slope efficiency typ. 0.28 W/A@85 °C • Key to low cost through simple packaging • Higher manufacturing and design tolerances for customers

  21. ML-T-1310-FP-2G5-F/B-X • Modulight’s high-performance 2.5 Gb/s nm 1310 nm FP chip in a TO-56 can • Available with flat window and ball lens caps • Ask for custom caps • Ball lens cap can with low beam divergence (<10°) • Stable focal distance • 100% gross leak test for hermeticity • 300-700 µA monitor PD current • 0.30 W/A slope efficiency 25°C (cw, with ball lens cap) • 0.22 W/A slope efficiency 85°C (cw, with ball lens cap)

  22. Customer interface – quality of service • Fast customer response • Modulight’s committed technical and sales personnel in your service for after-sales support • Product-specific quality plans available for customer review • Describing QC/QA activities in Modulight’s production in detail • Exact description of all verification and validation criteria • Easy access to production and verification data through Modulight’s manufacturing database • Delivery of all verification data to customer in electrical format • Full process traceability

  23. ML-C-1310-FP-2G5 – reliability

  24. ML-C-1310-FP-2G5 – threshold current 2nd derivative method

  25. ML-C-1310-FP-2G5 – frequency response

  26. ML-C-1310-FP-2G5 – 2.5 Gb/s eye pattern 2.488 Gb/s, Iop = 30 mA, ext ratio 9.24 dB. OC-48/STM-16 mask, 20% margin (Modulight 2.5 Gb/s die in customer sub-assembly, Iljin Corp.)

  27. ML-C-1310-FP-2G5 –2.5 Gb/s eye pattern ML-C-1310-FP-2G5 – for 1.25 Gb/s and 2.5 Gb/s 2.488 Gb/s, OC-48/STM-16 filter (Modulight 2.5 Gb/s die in Customer’s SFP transceiver)

  28. ML-T-1310-FP-2G5-F-3 Eye pattern after 55 km transmission Modulated spectrum • 55 km Gigabit Ethernet transmission, 13.5 dB extinction ratio, Pout = -0.2 dBm • 25 °C ambient temperature (Tc = 41°C) • λ=1310.08, λ = 0.88 nm • Modulight TO-canin Allied Telesyn (US) GigE transceiver sub-assembly

  29. ML-T-1310-FP-2G5-F-3 Eye pattern after 40 km transmission Modulated spectrum • 40 km Gigabit Ethernet transmission, 9.9 dB extinction ratio, Pout = -0.8 dBm • 70°C deg ambient temperature (Tc = 87.5°C) • λ=1325.10, λ = 0.79 nm • Modulight TO-canin Allied Telesyn (US) GigE transceiver sub-assembly

  30. 1310 nm FP epiwafers • Use Modulight’s standard production design in your own device process or • Base your own FP or DFB design on Modulight’s proprietary active area design • Exploit Modulight’s processing services for broad-area characterisation or device-level epiwafer qualification

  31. Modulight 1310 nm DFB products

  32. 1310 nm DFB laser products • Products for SONET OC-48, 1x/2x Fibre Channel and long-reach Gigabit Ethernet • ML-C-1310-DFB-2G5 • 300x300 µm bare die • ML-T-1310-DFB-2G5 • TO-56 can with flat window cap or aspherical lens cap

  33. 1310 nm DFB laser products • Active area design platform inherited from Modulight’s mature 1310 nm FP products • Focus on full operating temperature range (0-85°C), not just RT operation • Small slope saturation at elevated temperatures • Small beam ellipticity • Cost-effective grating process • Typ 43 dB SMSR • Typ 0.07 nm FWHM (-20 dB noise floor) • Temperature shift 0.09 nm/K

  34. ML-C-1310-DFB-2G5 – frequency response

  35. ML-C-1310-DFB-2G5 – 4 Gb/s modulation test • Data Rate 4 Gb/s. • PRBS: 231-1 • Eye Diagrams @ temperatures of 0, 25, 50, 75, 85, 100°C and link distances of 0km, 2km and 10km • Temperature compensation not optimized. • RF filter between LDD and LD not optimized. • Some ringing occurs in eyes, can be eliminated by optimized filter circuit • LD maintains SM operation with 40 dB SMSR at all evaluated operation conditions. • Clear open eyes @ all evaluated operation conditions • 10 km transmission with 4 Gb/s @ 0 - 100°C

  36. Link: 0 m; Temp.: 0°C

  37. Link: 0 m; Temp.: 25°C

  38. Link: 0 m; Temp.: 50°C

  39. Link: 0 m; Temp.: 75°C

  40. Link: 0 m; Temp.: 85°C

  41. Link: 0 m; Temp.: 100°C

  42. Link: 2 km; Temp.: 0°C

  43. Link: 2 km; Temp.: 100°C

  44. Link: 10 km; Temp.: 0°C

  45. Link: 10 km; Temp.: 100°C

  46. Future DFB products from Modulight • 2.5 Gb/s 1550 nm DFB die & TO-can • Long reach applications • 1490 nm DFB die & TO-can • PON • 10 Gb/s directly modulated 1310 nm DFB die • Based on Modulight’s 10G 1310 nm FP design • For uncooled transceivers/transponders

  47. Conclusion • Robust and manufacturable laser products • Strong customer focused technical pre and after sales • Key success factors • Agility, Reliability, Customer Focus and Profitability • Quality, environment and cost-effectiveness in mind • Volume manufacturing capacity in own building

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