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Flip Chip Research 2002

Flip Chip Research 2002. Peter Borgesen Project Manager. Assembly.  Lots of 0.2” single perimeter array, 8mil pitch assemblies on organic substrates.  5mm and 10mm full area arrays with 10mil pitch on organic substrates.

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Flip Chip Research 2002

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  1. Flip Chip Research 2002 Peter Borgesen Project Manager

  2. Assembly  Lots of 0.2” single perimeter array, 8mil pitch assemblies on organic substrates.  5mm and 10mm full area arrays with 10mil pitch on organic substrates.  Anticipate 10-25mm die with thousands of bumps on ceramics

  3. Reliability  ‘All’ combinations of 30-40 encapsulants and 20-40 fluxes LLTS (-55 to 125oC), AATC (-40 to 125oC), JEDEC-3 (260oC peak) Solder extrusions and fatigue, underfill fillet cracking and delamination Realistic manufacturing process variations  Effects of humidity, temperature, and aging Distinguish and accelerate Test protocols  Extrapolate test results to ‘life in service’

  4. Yield/Defect Prediction & Design for Assembly  Update defect prediction software Complex solder joint shape effects More userfriendly input  Fluxing defect prediction?

  5. Assembly in Air  Identify more tacky fluxes and some liquid fluxes (for DispenseJet). Test for chemical compatibilities & reliability (cycling, aging, humidity, JEDEC-3) Alternative pad finishes (immersion Ag or Sn)  Solder joint fatigue testing  Try no-Pb?

  6. Fluxing Alternaitves  Tacky fluxes vs. DispenseJet with liquids Jet process optimization for ‘typical’ damaged bumps Reliability (chemical compatibility), optimize underfill No-Pb

  7. Reflow Encapsulants  Continue to test new materials for Sn/Pb. Require wide reflow process windows Quantify windows for bake out, etc. for best ones Aging, moisture, and JEDEC-3 (260oC) for best

  8. Underfill Dispense Process  Update step-by-step ‘cook-book’ Major restructuring based on user feedback  Continue to characterize materials for dispensability, flow, fillet formation, wetting, ...  Emphasis on voiding

  9. Transfer Molding  Overmolded flip chip components: Warpage, popcorning, cycling, JEDEC-3 (260oC) Chemical compatibilities  Layout (die spacing, distance to edge, passives)

  10. Underfilling by Transfer Molding  Work with Dexter, Neu Dynamics, FICO, others Competitive mold compunds Behavior in JEDEC-3 (260oC), LLTS Warpage

  11. No-Pb Assembly  Better wetting and collapse (selfalignment) New fluxes (incl. DispenseJet), profiles, pad finishes  Chemically compatible underfills  Effects of reflow profiles and number of reflows  In-depth metallurgy studies

  12. Ceramics  Assembly and reliability issues Depending on access: LTCC, high-CTE

  13. Flex  Thermal shock and air-to-air cycling of specific assemblies  Further studies depend on access

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