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The Advantages of Flip-Chip Design

The Advantages of Flip-Chip Design

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The Advantages of Flip-Chip Design

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  1. The Advantages of Flip-Chip Design February 2003 John Park

  2. What is Flip-Chip? • Flip-Chip IS- • A method to electrically connect the die to the package carrier • Lead Frame or Substrate • The bond wire is replaced with a conductive “bump” placed directly on the die surface • Under-fill epoxy is used to secure the attachment and absorb stress • The chip is then “flipped” face down onto the package carrier using a re-flow process • Bump sizes range from 90-125 microns in diameter • Height ranges from 60-100 microns • Also known as C4 (Controlled Collapsible Compression Connection) • Invented by IBM • Flip-Chip is NOT- • A specific package like SOIC • A specific package type like BGA

  3. Flip-Chip Advantages • Reduced Signal Inductance • Shorter Interconnect Lengths • Use Power More Efficiently • Power Directly at the Core • Higher Interconnect Density • More Routable Area • Smaller Package Size • Chip Scale Packaging (CSP) • I/O Not Controlling Core Size • (Core) Area I/O Placement • Possible Die Shrink Flip-Chip Ball Grid Array (BGA)