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Ladder assembly steps

Ladder assembly steps

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Ladder assembly steps

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  1. Ladder assembly steps HFT PIXEL updated for ultimate chip ladders 2/12/2012 ladder fixture u.SLDASM

  2. ladder assembly with frame assembly frame full flex cable before cutting off ends

  3. ladder exploded view cable bundle drivers kapton flex cable pixel chips adhesive composite backer adhesive wire bonds capacitors

  4. order of assembly cable bundle drivers 7 kapton flex cable 1 pixel chips adhesive composite backer 6 adhesive 4 2 5 1 3

  5. details of ladder sandwich, end view wire bonds Carbon composite recessed to give room for vacuum chuck backing of kapton and silicon while wire bonding capacitors adhesive extends past bonded element to avoid bulge due to adhesive pucker pixel chips soft acrylic adhesive flex kapton cable soft acrylic adhesive carbon composite ladder backing backer to sector beam adhesive

  6. ladder assembly fixture 3/8 OD tube connection to vacuum vacuum distribution manifold vacuum release valve for hold down of the vacuum chucks ¾ ID tube connection to 1 gallon vacuum ballast tank

  7. fixture parts (SLA and aluminum) for bonding silicon chips v chuck chip u.SLDPRT chip adhesive stop u.SLDPRT chip stop u.SLDPRT end drop chip.SLDPRT

  8. fixture parts for bonding composite backer v chuck backer u.SLDPRT backer adhesive stop u.SLDPRT backer stop u.SLDPRT end drop backer.SLDPRT

  9. install chip vacuum chuck against stops (arrow toward arrow) open valve to vacuum lock down line. install chip vacuum chuck

  10. install chip adhesive stop u.SLDPRTand lock down if necessary with vacuum position paper backed adhesive and pull down with 10 vacuum lines strip top backing paper position ladder and lock down with vacuum positionend drop chip.SLDPRT and lock with vacuum work kapton down on adhesive release adhesive hold down vacuum release ladder and “end pull down” vacuum remove ladder and maybe seat adhesive with vacuum bag attach chip adhesive to kapton cable

  11. release and remove chip vacuum chuck note: since this is an O ring seal it may be necessary to use vacuum release valve (see page 6) install backer vacuum chuck against stops (arrow toward arrow) open valve to vacuum lock down install backer vacuum chuck

  12. install backer adhesive stop u.SLDPRTand lock down if necessary with vacuum position paper backed adhesive and pull down with vacuum (chp 1) strip top backing paper position ladder and lock down with vacuum position “end pull down” and lock with vacuum work kapton down on adhesive release adhesive hold down vacuum release ladder and “end pull down” vacuum remove ladder and maybe seat adhesive with vacuum bag backer adhesive to kapton cable

  13. position and lock down backer stop u.SLDPRT lock down backer on vacuum chuck, may require backing tape on composite if porous strip adhesive backing paper position ladder on reference pins and pull down with vacuum position “end pull down” and lock with vacuum work kapton down on backer, must push down on chips release backer hold down vacuum release ladder and “end pull down” vacuum remove ladder and seat chips and backer with vacuum bag attach backer to kapton cable

  14. switch to v chuck chip u.SLDPRT position and lock down chip stop butt chips one at time against chip stop u.SLDPRT and neighbor chip and lock down with vacuum. strip adhesive backing paper position ladder on reference pins and pull down with vacuum position “chip end pull down” and lock with vacuum work kapton down on chips release chip hold down vacuum release ladder and “end pull down” vacuum remove ladder and seat chips and backer with vacuum bag attach chips to kapton cable

  15. comments • Both SLA vacuum chucks have been modified to fit ultimate ladders • Reference holes on the flex PC carrier extensions have been moved to be compatible with the ladder to sector bonding tools. That change is accommodated here with adjustments in the SLA vacuum chucks. • New stops are of aluminum, replacing SLA pieces. • If the SLA vacuum chuck is flat enough then stops for the backer could also be used for the chip and chip adhesive bonding steps. • The chip vacuum chuck has holes reduced from 1.5 mm to .75 mm • These instructions do not include Mario’s notes. It would be desirable to include his notes, but they are probably not currently in electronic form