1 / 15

DAQMB Production Status

DAQMB Production Status. S. Durkin The Ohio State University Florida EMU Meeting 2004. DAQMB Production. EMU Peripheral Crate ESR Nov. 6, 2003 Approved for Production. 8-layer PC Board, 2 Ball-Grid Array FPGAs 718 Components/Board. Production : Numbers.

ivana-avila
Télécharger la présentation

DAQMB Production Status

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. DAQMB Production Status S. Durkin The Ohio State University Florida EMU Meeting 2004

  2. DAQMB Production EMU Peripheral Crate ESR Nov. 6, 2003 Approved for Production 8-layer PC Board, 2 Ball-Grid Array FPGAs 718 Components/Board

  3. Production : Numbers • 10% of spare boards will be built for anticipated swapping, • 10% spare parts will be ordered for board repair All Parts Ordered, 99% of Parts in Hand

  4. Production PC boards will be etched and stuffed commercially Boards will be measured and debugged on computerized tester before and after burn-in at OSU Each board will have a unique ID Board tracking: Microsoft Access

  5. Production Test and Debugging • Testing Station checks all input and output signals by computer • Exercise 5 CFEB’s and LVMB • CCB,TMB signals mimicked by FPGA on backplane Test Station Built and Working

  6. Production Test Software Production Test Software written and tested.

  7. Production preparation: Burn in Burn In CDF: 50-60 C for 8-24 Hrs Sufficient for tantalums failures No sensitivity to semiconductor failure US Military: 125 C for 320 Hrs Chip Makers recommend against this CFEB: 65 C for 24 Hrs Prove to be effective, not damaging Each DMB: 65C for 24 Hrs Test Before and After

  8. Pre-Production Boards • 11 DAQMB delivered (Nov 19, 2003) • Stuffed commercially, No problems, Work well Costs: PC Board $ 200 Stuffing $ 60 Components $ 750 Mechanical $ 100 Total: $ 1110 DAQMB well within Budget Full Production will begin when a Complete Crate of Electronics is tested

  9. New Crate Controller Development A VMEbus Controller with Gigabit Ethernet • A custom board designed and developed at OSU • Based on XILINX Virtex-II Pro • Customizable firmware. • Optical transceiver (for Gbit Ethernet) • Communicates with stand-alone PC (in USC55) via Ethernet Advantages Over Dynatem • No operating system or software on the controller. All programming done on stand-alone PC in USC55. • Faster, less expensive: ~ $600 each Status • PC board produced and stuffed • Firmware being developed

  10. DDU and DCC Status Peripheral Crates DMB to DDU Gb/s Fibers Myrinet 5Gb/s Fibers SLINK64 CMS DAQ FRL FED Crate (DDU/DCC) CFEB ALCT USC55 AFEB 540 DMB as inputs (160MB/s) 8 SLINK64 as outputs (800MB/s) Detector Expected data rate 1.2 GB/s

  11. FED Crate • Four 9U Crates 9U X 220mm Board • Data Concentration: 15 DMB to 1 DDU 9 DDU to 1 DCC 1 DCC to 2 SLINK64 9 DDU per SLINK (4) 4/5 DDU per SLINK (8) 2/3 DDU per SLINK (16) 1 DDU per SLINK (36) 36 DDU, 4/8 DCC needed D C C DDU DDU Base-line design Optional

  12. DDU/DCC custom backplane DDUs DCC DDUs DDUs DCC DDUs VME P3 spaces, 6.4 Gbps rated connector Data from DDU to DCC TTC control bus (clock, L1A, command/data)

  13. DDU-04 Function • Collect data from 15 DMB (15*160MB/s), Send data to DCC (640MB/s) • Check data, Detect error, send to FMM • Spy data by Gigabit Ethernet • Capable of SLINK64 Improvements over DDU-02: Earlier error detection Better PCB timing More reliable Higher effective data bandwidth DMBs VP20 SLINK64 To FMM Gigabit Ethernet VP20 DCC DMBs

  14. DCC Function • Merge data from 10 DDU (10*640MB/s), send to CMS DAQ SLINK64 (2*800MB/s) • Receive and fan out TTC fast control for the crate • Spy data by two Gigabit Ethernet links • Expected: Constant 800MB/s on SLINK64 >100MHz DDR FIFO extra 1MB buffer for the SLINK64 error detection ability SLINK64 Gigabit Ethernet VP20 TTCrx DDUs VP2 Gigabit Ethernet FIFO SLINK64

  15. Status • DCC PCB Ordered, DDU PCB • FPGA firmware: Being Developed • System will be ready before 2004 slice test We are confident in the design We are working hard on the system

More Related