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Hierarchical, physical-aware, built-in self-repair of embedded memories

Hierarchical, physical-aware, built-in self-repair of embedded memories. V.R. Devanathan, Harsharaj Ellur, Mohd. Imran, Shivani Bathla Texas Instruments India Pvt. Ltd. {vrd, harsharaj.ellur, m-beg, shivani}@ti.com. 1. Motivation.

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Hierarchical, physical-aware, built-in self-repair of embedded memories

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  1. Hierarchical, physical-aware, built-in self-repair of embedded memories V.R. Devanathan, Harsharaj Ellur, Mohd. Imran, Shivani Bathla Texas Instruments India Pvt. Ltd. {vrd, harsharaj.ellur, m-beg, shivani}@ti.com 1

  2. Motivation • Need area efficient memory test/repair flow over native EDA solution, with support for incremental repair • Total test and repair area overhead as high as 1M gate!

  3. Optimizing BIST datapath[1] Grp4 Grp4 Grp3 Grp3 Grp1 Grp1 Grp5 Grp2 Grp2 Grp5 LEGEND : Level 0 Group : Level 1 Group : Level 2 Group LEGEND : Level 0 TIA pipelines : Level 1 TIA pipelines : Level 2 TIA pipelines Pipelines assigned on each data-path branch using TIA heuristics Physical-aware grouping of clusters • Automated, physical-aware grouping to ease congestion • Timing & interconnect-aware pipelining to ease timing closure [1] V. R. Devanathan, et. al., “Novel approaches for effective and optimized memory test flow in nanoscale technologies”, VTS 2012

  4. Optimizing BIRA datapath BIRA BIRA BIRA BIRA Grp4 Grp4 Grp3 Grp3 Grp1 Grp1 Grp2 Grp2 BIRA BIRA data-path grouping overview Grp4 Grp4 BIRA architecture overview Grp4 Grp3 Grp3 Grp3 Grp5 Grp1 Grp1 Grp5 Grp1 BIRA BIRA BIRA BIRA BIRA BIRA Grp2 Grp2 Grp2 BIRA BIRA BIRA BIRA BIRA BIRA BIRA execution on Grp2 BIRA execution on Grp4 BIRA execution on Grp3 Grp5 Grp5 Grp5 • Physical-aware sharing of BIRA across multiple memories • Group temporally separated memories, with similar repair code • Timing and interconnect-aware BIRA data-path pipelining

  5. Proposed self-repair execution flow M1 M2 M6 M3 M4 M5 FDI FDI FDI FDO FDO FDO FDI FDO FDI FDO FDI FDO BISoR + BIRA MemGrp1 EFUSE MemGrp2 FuseROM PBIST Test group 1 Soft-repair group 1 Soft-repair group 2 Hard-repair on SoC Test group 2

  6. Optimizing Fuse ROM storage INCREMENTAL REPAIR ON MEM1 & MEM3 • Dynamic re-configuration of memory fuse chain • Store only repaired memory data in FuseROM • Support for incremental repair with intelligent bypass wrappers REPAIRING MEM0, MEM2 & MEM5

  7. Robust repair verification flow • BIRA & BISoR shared across different memories, with different configurations. • Need fool-proof verification on each memory. FDI Soft repair Mem0 FDI Repair code BIRA Mem0 FDI Mem0 Q Run BIST with self-repair Q Mem_Q Q FDO FDO Soft unload FDO Run BIST with self-repair Run BIST post-self-repair PBIST TCL based fault injection TCL based fuse register comparator BISoR Verification Complete PASS Per-instance unique fail injection Expected fuse register value FAIL Check BISoR integration / flow parameters

  8. Results: BIST and Repair data-path area PD flylines for level-0 + level-1 datapath routes for a SoC core,without physical-aware flow PD flylines for level-0 + level-1 datapath routes for a SoC core,with the proposed flow • Reduced congestion with proposed BIST/BIRA data-path grouping • Significant (~6X) area reduction over native EDA solution

  9. Results: FuseROM area • Significant area reduction without (and with) incremental repair • Compaction-based native EDA solution: 2.3X (and ~44%) • Proposed dynamic re-configuration: 6.6X (and 4.5X) • Compaction (native EDA solution) may be used over the proposed technique for further area reduction

  10. Conclusion • A novel self-repair flow is presented, that provides • ~6X reduction in data-path area, over native EDA flow • ~2.5X reduction in FuseROM area, over native EDA flow • Automated, physical-design friendly generation of structured BISR data-path • Incremental repair support • Proposed flow is vendor-agnostic and pluggable into vendor EDA BISR solution

  11. Thank You!

  12. Built-In Soft-Repair (BISoR) controller FDI FDO FDI FDI Mem0 FDI FDI Mem0 Repair code Repair code Mem0 Q Mem_Q Q Q Fail encode BIRA Mem_ID fclk Mem_ID FCLK FCLK FCLK Mem_fclk[N-1:0] BISoR Mem_ID CG CG CG fuse clock leaker Fuse_length per mem_ID Trigger . . . 0 CG Bira_fclk Fuse_clk • Soft-repair triggered by PBIST after test of each group. • Each BIRA/BISoR is shared across ‘N’ memory groups.

  13. Built-in Hard-repair controller Memory Fuse Register Chain fdi fdo … M0 M1 M2 MM-2 MM-1 W Fuse auto-load Fuse auto-unload EFUSE Fuse ROM R … Control / reserved bits C W • EFUSE controller enhanced for hard-repair • Shift out soft-repaired memory fuse chain, slice data wrt FuseROM data-width (W), and automatically blow/write data into FuseROM

  14. Support for incremental repair: BISoR • Minor enhancements to BIRA and BISoR • BIRA: Merging of old repair and new repair code • BISoR: Increased clock-leaker pulses and additional trigger BIRA Merge FDI FDO Repair code Mem0 FDI FDI Merged repair code Init repair code Mem0 FDI FDI Mem0 Q Q Fail encode Q Mem_Q Mem_ID fclk Merge_Trigger Mem_ID FCLK FCLK FCLK BISoR Mem_fclk[N-1:0] Mem_ID CG CG CG fuse clock leaker (2*Fuse_length+1) per mem_ID Trigger . . . 0 CG Bira_fclk Fuse_clk Delay (Fuse_length per mem_ID cycles)

  15. Support for incremental repair: FuseROM • Bypass wrapper supporting incremental repair

  16. Results: BIST and Repair data-path area • Negligible (~1%) impact to test time with proposed self-repair flow

  17. Results: FuseROM area • Significant area reduction without (and with) incremental repair • Compaction-based native EDA solution: 2.3X (and ~44%) • Proposed dynamic re-configuration: 6.6X (and 4.5X) • Compaction (native EDA solution) may be used over the proposed technique for further area reduction

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