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Status of CALICE ECal Presented by Andy White on behalf of the CALICE ECal Group

Status of CALICE ECal Presented by Andy White on behalf of the CALICE ECal Group (using mainly material from presentation to DESY-PRC May 27,2004 – A.White, with updates from CALICE meeting at CERN, June 2004) ALCPG, Victoria, BC July 2004. ECAL Requirements.

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Status of CALICE ECal Presented by Andy White on behalf of the CALICE ECal Group

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  1. Status of CALICE ECal Presented by Andy White on behalf of the CALICE ECal Group (using mainly material from presentation to DESY-PRC May 27,2004 – A.White, with updates from CALICE meeting at CERN, June 2004) ALCPG, Victoria, BC July 2004

  2. ECAL Requirements Physics requirements emphasize segmentation/granularity (transverse AND longitudinal) over intrinsic energy resolution. Localization of e.m. showers and e.m./hadron separation -> dense (small X0) ECal with fine segmentation. Moliere radius -> O(1 cm.) – from min. charged/neutral separation. Transverse segmentation  Moliere radius Tracking charged particles through ECal -> fine longitudinal segmentation and high MIP efficiency. Excellent photon direction determination (e.g. GMSB) Keep the cost under control!

  3. CALICE - Electromagnetic Calorimeter • A tungsten/silicon sampling calorimeter • Design well advanced, first stack produced • Silicon wafers in production – high quality verified • Readout PCB designed – production set • Very front-end readout chips produced • Single Slab DAQ system developed for first full chain readout and channel calibration • VME DAQ system for full prototype being developed • Very active program towards test beam – end of 2004 (low energy electrons) - 2005-6… hadrons and electrons

  4. TESLA Detector – enlarged quadrant

  5. ECal System Design • No large dead zone • All modules identical

  6. 9720 channels in prototype

  7. First stack elements Wafers: Russia/MSU and Prague/IOP First structure from LLR PCB: LAL design, production – Korea/KNU

  8. Detector slab details

  9. ECal – Si Wafers for Prototype MSU Leakage current (nA) IOP Group with lower currents 270 wafers needed: ~150 produced by MSU ~150 in prod. by IOP/Prague

  10. Some details of ECal prototype assembly Placing wafers on PCB Applying conductive glue Wrap in aluminum foil – connect wafers to PCB ground (conductive EPO-TEK glue) Finished PCB – ready to start production (two days/PCB)

  11. Front-end electronics for the prototype LAL-Orsay FLC_PHY3 in production

  12. First results with complete detector slabs First results from source Sr90 source -> trigger -> read 1 channel Wafer from Academy of Sciences/ Prague

  13. Cosmic test bench at LLR Upper x and y planes of hodoscope XY plane : 16x16 scintillators Active area : 44x44 cm2 Cosmic Rate : ~ 1 Hz “good” event : 90 % Silicon Lower x and y planes of hodoscope The cosmic test bench at LLR

  14. Test Bench : PCB - FLCPHY2 - DAQCalib • Single Slab DAQ (SSD) • ● for calibration and test on Cosmic Test bench • ● work only for a single detector slab • (24 VFE chips/ 432 silicon pad channels) • ● based on NI board (on-shell)

  15. Results from Cosmics/Single Slab DAQ ~ 24 hours to calibrate one slab

  16. DAQ for ECAL Prototype • Eight Front End (FE) FPGAs control all signals to front end electronics via front panel input connectors • Back End (BE) FPGA gathers and buffers all event data from FE and provides interface to VME • Trigger logic in BE for timing and backplane distribution; only active in one board • Each input is one full or two half-full VFE-PCBs; need 45 inputs = 6 CERCs The CERC

  17. First results from cosmics and CERC Landau-Gaussian fits

  18. Preparations for test beam …DESY late 2004 beam Tilt  X ECAL  Y HCAL

  19. Recommendations from 57th DESY-PRC …..etc….

  20. ECal Summary/Future • A lot of progress ! • All items required for first full prototype are in hand or in production. • Objective: exposure of first full prototype to low energy electron test-beam at DESY before the end of 2004. • Future: expose prototype to higher energy electron beam, and hadron beam at FNAL/IHEP in combination with HCal prototypes (various options).

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