1 / 21

Analysis of Heterojunction Bipolar Transistors

Analysis of Heterojunction Bipolar Transistors. Outline. 3-D Structure of Single Finger and Three Fingers C-up HBT A 3-D modal of single finger and three fingers C-up HBT Adjust the Thickness of PHS Layer and GaAs Substrate Compare with the results of 2- D modal

ebony-grimes
Télécharger la présentation

Analysis of Heterojunction Bipolar Transistors

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Analysis ofHeterojunction Bipolar Transistors

  2. Outline • 3-D Structure of Single Finger and Three FingersC-up HBT • A 3-D modal of single finger and three fingers C-up HBT • Adjust the Thickness of PHS Layer and GaAs Substrate • Compare with the results of 2- D modal • The results under the different boundary condition • Conclusion

  3. 3-D Structure of Single Finger C-up HBT

  4. A 3-D Modal of Single Finger C-up HBT

  5. Temperature distributions in C-up HBT of 3-D Modal (1/4 Symmetry)

  6. Temperature distributions in C-up HBT of 3-D Modal Shows by Isosurface (1/2 Symmetry)

  7. Compare with the Results of 2- D Modal

  8. Adjust the Thickness of PHS Layer and GaAs Substrate

  9. 3- D Modal Temperature distributions Compare with the Results of 2- D Modal The Temperature distributions of 3- D Modal The Temperature distributions of 2- D Modal

  10. 3- D Modal Temperature distributions Compare with the Results of 2- D Modal (con.) The Temperature distributions of 3- D Modal The Temperature distributions of 2- D Modal

  11. 398 298.5 Comparison of temperature distribution in C-up HBT with a thicker and a thinner thermal via Original thicker thermal via： Substrate＝19.5um； PHS＝8um A thinner thermal via： Substrate＝13.5um； PHS＝6um

  12. 3-D Structure of ThreeFinger C-up HBT

  13. A 3-D Modal of Three Finger C-up HBT

  14. Temperature distributions in C-up HBT of 3-D Modal by Finger Pitch = 18 um (1/4 Symmetry)

  15. Temperature distributions in C-up HBT of 3-D Modal by Finger Pitch = 10 um (1/4 Symmetry)

  16. Temperature distributions in C-up HBT of 3-D Modal Shows by Isosurface (1/2 Symmetry) Finger Pitch = 18 um

  17. Temperature distributions in C-up HBT of 3-D Modal Shows by Isosurface (1/2 Symmetry) Finger Pitch = 10 um

  18. 3- D Modal Temperature distributions Compare with the Results of 2- D Modal (Finger Pitch = 18 um ) The Temperature distributions of 3- D Modal The Temperature distributions of 2- D Modal

  19. 3- D Modal Temperature distributions Compare with the Results of 2- D Modal (con.) The Temperature distributions of 3- D Modal The Temperature distributions of 2- D Modal

  20. Compare with the Results of 2- D Modal

  21. Conclusion • The relation of maximum temperature to substrate thickness is linear, and the relation of maximum temperature to PHS thickness is a cubic equation in 2D and 3D analysis. • The temperature distribution of 3D modal is similar to 2D modal, but the result of 2D modal is higher than that of 3D modal. • The 3D analysis of 1-finger C-up HBT shows that the thickness of thermal via can be reduced 32% to provide the same thermal performance.

More Related