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HCC – present status

HCC – present status. Original estimate of device size was 3.5mm x 3.5mm (area ~ 12.25mm 2 ) All costing based on this size Any changes in area can impact upon price... Lots of progress now made BUT device is coming in with 117 bond pads (see below)

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HCC – present status

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  1. HCC – present status • Original estimate of device size was 3.5mm x 3.5mm (area ~ 12.25mm2) • All costing based on this size • Any changes in area can impact upon price... • Lots of progress now made BUT device is coming in with 117 bond pads (see below) • Pad ring requires 2 sides being duplicated because of hybrid constraints, 41 bonds/side (82 total) • Effectively one side of device is not accessible when attached to a hybrid • Having 2 differing flavoured hybrids makes the duplication necessary • Big driver of chip size and cost- • Numerous iterations of pad ring have been made • Converging to a fixed pad ring description • Making use of ABC130 differential drivers/receivers • Saves reinventing the wheel but requires additional area – apparent towards the corners (450µm keep clear) As of today – needs to be checked Guessed size Bump Bonding 16.2mm2 13.5mm2 7.3mm2 12.25mm2 Time

  2. HCC – present status • As of today • Moved bond pads around whilst trying to maintain minimal duplication • Biggest change is powering now brought in towards the bottom of the device and not the sides • Rest remains more or less the same • Still lots of unknowns • Use of different value capacitors makes it difficult in real estate usage on hybrid • Better to converge to a singe value of capacitance (using arrays) • Array footprint is much smaller – original reason for power pads placed on side decoupled with a single array • Otherwise have to make use of 0402s and 2 x capacitor array Hybrid Data Chip area ~ 13.5mm2 (10% oversize compared to original) Stave TTC ABC130 TTC ABC130 TTC Auxiliary Connections Auxiliary Connections Power Block ABC130 Data ABC130 Data ABC130 Data ABC130 Data

  3. HCC – present status Does it fit on a hybrid? Appears to with no change to hybrid geometry ABC130 TTC Bus yet to be routed PLL and Bandgap Decoupling Power Supply decoupling (100nF and 1µF)

  4. HCC – present status • Alternative, more aggressive proposal, courtesy of Nandor/(Mitch) at Penn • Makes use of dual row bonding throughout • Device size comes in at 3mm x 3mm – though will probably increase.

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